--- title: Direct-to-Chip & Liquid Cooling Solutions | CoreCooling description: Explore CoreCooling solutions for CPUs, GPUs and data centers—from Direct-to-Chip cooling and heat spreaders to high-temperature liquid cooling and heat reuse. --- [CONTACT US: INFO@CORECOOLING.DE](mailto:info@corecooling.de) - [Solutions](https://www.corecooling.de/en/solutions) - [Systems](https://www.corecooling.de/systems171819knewhomeg) - [R&D](https://www.corecooling.de/rd171819knewhomeg) - [Capabilities](https://www.corecooling.de/171819knewhomeglabs) - [Company](https://www.corecooling.de/171819knewhomegcompany) [![CoreCooling](https://www.corecooling.de/hs-fs/hubfs/black_logo_transparent_background.png?width=2000&height=1200&name=black_logo_transparent_background.png "CoreCooling")](http://www.CoreCooling.de) This is a search field with an auto-suggest feature attached. - There are no suggestions because the search field is empty. [Contact Us](https://www.corecooling.de/contactform?hsLang=en) # Advanced Liquid Cooling Solutions for AI, HPC & Data Centers ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![Direct-cooled CPU heat spreader developed by CoreCooling](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-direct-cooled-heat-spreader.jpg)](https://www.corecooling.de/contactform?hsLang=en) ## DIRECT-COOLED CPU HEATSPREADERS Our CPU cooling technology uses direct impingement on the heatspreader itself — without additional TIM layers, cold plates or unnecessary thermal interfaces. Cooling structures are integrated directly into the heatspreader, reducing thermal resistance and improving heat transfer at the source. The geometry can be adapted to the chip layout and heat distribution of the respective CPU.  [Discuss your application](https://www.corecooling.de/contactform?hsLang=en) ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![CoreCooling logo on glass panel](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-glass-logo.jpg)](https://www.corecooling.de/contactform?hsLang=en) ## DIRECT-TO-CHIP COOLING For applications with extreme thermal loads, CoreCooling develops Direct-to-Chip cooling solutions that minimize the thermal path between the semiconductor and the cooling system. Our approach combines thermal design, surface metallization, solder deposition, joining technology and liquid-cooled heatsinks in one integrated process. This enables highly optimized cooling assemblies for CPUs, GPUs and next-generation AI and HPC processors.  [Talk to our engineers](https://www.corecooling.de/contactform?hsLang=en) ![Direct-to-Chip liquid cooling components for processors](https://www.corecooling.de/hs-fs/hubfs/Website%20Pictures/corecooling-direct-to-chip-liquid-cooling.png?width=1179&height=340&name=corecooling-direct-to-chip-liquid-cooling.png "Direct-to-Chip liquid cooling components for processors") ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![Liquid cooling solution for a high-performance GPU](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-gpu-liqui-cooling.jpg)](https://www.corecooling.de/contactform?hsLang=en) ## GPU LIQUID COOLING CoreCooling develops compact liquid cooling solutions for GPUs used in AI, HPC, edge computing and industrial applications. Direct heat removal allows higher power densities and reduces the space required for conventional air-cooling hardware. Our GPU cooling concepts are adaptable to different platforms and designed for reliable operation even at elevated coolant temperatures and sustained high loads.  [Discuss GPU cooling](https://www.corecooling.de/contactform?hsLang=en) ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![Liquid-cooled server components and cooling assemblies](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-liquid-cooled-server-components.png)](https://www.corecooling.de/contactform?hsLang=en) ## LIQUID COOLING FOR IT COMPONENTS Efficient system cooling requires more than cooling the CPU and GPU. CoreCooling develops application-specific cooling solutions for memory, SSDs, network interfaces, power electronics and other thermally critical components. Individual coolers can be combined into integrated thermal assemblies to create compact, reliable and efficient liquid-cooled server architectures.  [Discuss your requirements](https://www.corecooling.de/contactform?hsLang=en) ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![Laser-structured heat spreader for direct liquid cooling](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-laser-structured-heat-spreader.jpg)](https://www.corecooling.de/contactform?hsLang=en) ## ADVANCED HEATSPREADER TECHNOLOGY CoreCooling develops microstructured heatspreaders with cooling geometries tailored to the thermal layout of the processor. Precise laser processing allows cooling channels to be integrated directly into the heatspreader, reducing additional interfaces and enabling uniform heat distribution. The result is a compact and scalable approach for high-performance CPUs, servers and HPC applications.  [Discuss heat spreader cooling](https://www.corecooling.de/contactform?hsLang=en) ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![High-temperature liquid cooling performance and efficiency overview](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-high-temperature-liquid-cooling.png)](https://www.corecooling.de/contactform?hsLang=en) ## HIGH-TEMPERATURE LIQUID COOLING CoreCooling develops liquid cooling concepts for operation at elevated coolant temperatures. Higher return temperatures can reduce cooling energy demand while increasing the potential for efficient heat recovery and reuse. This creates better conditions for recovering and reusing waste heat in data centers, buildings, and industrial environments.  [Talk to our engineers](https://www.corecooling.de/contactform?hsLang=en) ![white\_icon\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_icon_transparent_background.png?width=100&height=72&name=white_icon_transparent_background.png) [![Data center infrastructure for liquid cooling retrofit and heat reuse](https://www.corecooling.de/hubfs/Website%20Pictures/corecooling-data-center-retrofit-heat-reuse.jpg)](https://www.corecooling.de/contactform?hsLang=en) ## DATA CENTER RETROFIT & HEAT REUSE Liquid cooling can also be integrated into existing IT and data center infrastructure. CoreCooling develops retrofit concepts ranging from individual component upgrades to complete thermal solutions for server environments. By combining direct liquid cooling with elevated coolant temperatures, existing infrastructure can be prepared for increasing AI and HPC power densities while improving the potential for efficient heat recovery and reuse.  [Discuss your infrastructure](https://www.corecooling.de/contactform?hsLang=en) ![white\_logo\_transparent\_background](https://www.corecooling.de/hs-fs/hubfs/Logo/white_logo_transparent_background.png?width=2000&height=1200&name=white_logo_transparent_background.png "white_logo_transparent_background") ### Connect with us - [![Linkedin](https://www.corecooling.de/hubfs/raw_assets/public/@marketplace/1406_Consulting/1406_Clarity_Lite_Free/images/Linkedin.png)](https://www.linkedin.com/company/98904325/)   CoreCooling Ericsson-Allee 1 | 52134 Herzogenrath | GERMANY [info@corecooling.de](mailto:info@corecooling.de)   CoreCooling is a registered trademark of XCCES GmbH **[Legal Notice](https://www.corecooling.de/legal-notice?hsLang=en)** [**Privacy Policy**](https://www.corecooling.de/privacy-policy?hsLang=en) Copyright © 2026 XCCES GmbH. All Rights Reserved.