SEVEFORM (R&D project)

SELF-REGULATING LIQUID COOLING

SEVEFORM investigates passive, self-regulating coolant flow control for liquid-cooled servers. Temperature-dependent flow regulation using Shape Memory Alloys enables cooling capacity to adapt automatically to the thermal load of individual components — without active control electronics.

The goal is to improve flow distribution, energy efficiency and system reliability while simplifying the thermal management of densely integrated server systems.

ERIKA

HIGH-TEMPERATURE COOLING FOR HEAT REUSE

ERIKA focuses on high-temperature liquid cooling for data centers. The project aims to increase coolant outlet temperatures while maintaining reliable component cooling, creating better conditions for efficient waste-heat recovery.

Higher usable heat levels can support integration into district heating, building heating and industrial applications while reducing the energy required for conventional cooling infrastructure.

SEVEFORM Feasibility study

Title	Development and initial validation of a passive, self-regulating flow control system for server liquid cooling (SEVEFORM)
Topic	Passive flow control for liquid-cooled servers, shape-memory alloys, self-regulating valves and high-temperature cooling
Funding program	ZIM – Feasibility Study (Programme of the German Federal Government BMWK)
Project duration	01/01/2025 – 08/31/2025
Partner	XCCES GmbH

FROM CONCEPT TO SELF-REGULATING COOLING

The SEVEFORM feasibility study investigated the technical potential of passive, temperature-dependent flow regulation for liquid-cooled server systems. The work provided the foundation for the development of self-regulating cooling concepts using thermally activated flow-control elements.

The results formed the basis for the subsequent development of the SEVEFORM technology.

 Green ICT / COCO

HOT-WATER COOLING FOR ENERGY-EFFICIENT IT

The GREEN ICT / COCO project investigated high-temperature cooling concepts for IT components with a focus on efficient thermal interfaces and reduced thermal resistance. The objective was to transfer component heat into the liquid cooling circuit at the highest practical temperature level.

This approach improves cooling efficiency and increases the potential for subsequent waste-heat utilization in energy-efficient IT and data center environments.