WE COOL THE FUTURE.
Liquid Cooling Solutions for AI, HPC & Data Centers
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LIQUID-COOLED HPC & AI SYSTEMS.
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ADVANCED LIQUID COOLING SOLUTIONS
From CPUs and GPUs to memory, storage and power electronics, CoreCooling develops application-specific liquid cooling solutions for high-performance IT.
Our technologies include Direct-to-Chip cooling, direct-cooled heatspreaders, GPU cooling and customized thermal assemblies — engineered around the actual requirements of the component and system.
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HIGH-TEMPERATURE LIQUID COOLING
CoreCooling develops liquid cooling technologies designed for efficient operation at elevated coolant temperatures. Higher return temperatures can reduce cooling energy demand while increasing the potential for efficient heat recovery and reuse.
This creates better conditions for recovering and reusing waste heat in data centers and high-performance computing environments.
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ENGINEERED. TESTED. VALIDATED.
From thermal simulation and rapid prototyping to testing in real server environments and long-term validation, CoreCooling develops cooling solutions within an integrated engineering environment.
This allows us to optimize thermal performance, system efficiency, reliability and integration from the first concept to validated hardware.
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