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      RESEARCHING THE NEXT GENERATION OF LIQUID COOLING

      CoreCooling develops technologies for the next generation of high-performance thermal management. Our R&D activities focus on high-temperature liquid cooling, passive flow control, advanced thermal interfaces and improved heat reuse for future AI, HPC and data center systems. 

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      SEVEFORM (R&D project)

      Title

      Development of a self-regulating liquid cooling system for servers using shape-memory alloy valves (SEVEFORM)
      Topic Passive, self-regulating liquid cooling for data centers, shape-memory alloy valves, stable return temperatures and waste heat recovery 
      Funding program

      ZIM (Programme of the German Federal Government BMWE)corecooling-logo-bmwe-zim
      Project duration 04/01/2026 –03/31/2028
      Partner memetis GmbH, XCCES GmbH 

       

       

      SELF-REGULATING LIQUID COOLING

      SEVEFORM investigates passive, self-regulating coolant flow control for liquid-cooled servers. Temperature-dependent flow regulation using Shape Memory Alloys enables cooling capacity to adapt automatically to the thermal load of individual components — without active control electronics.

      The goal is to improve flow distribution, energy efficiency and system reliability while simplifying the thermal management of densely integrated server systems.

       

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      ERIKA

      Title

      Energy efficiency in data centers through innovative cooling technologies and optimized waste heat utilization (ERIKA) 
      Topic High-temperature direct liquid cooling for data centers, waste heat recovery, heat network integration and optimized heat utilization  
      Funding program

      8th Energy Research Programme of the German Federal Government (BMWE)

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      Project duration 01/2026-12/2028
      Partner Fraunhofer IEE, Fraunhofer IZM, IKEM e.V., Stadtwerke Norderstedt, SCHÄFER Ausstattungssysteme GmbH, Thomas-Krenn.AG, XCCES GmbH, GEF Ingenieur AG, YADOS GmbH 

       

       

      HIGH-TEMPERATURE COOLING FOR HEAT REUSE

      ERIKA focuses on high-temperature liquid cooling for data centers. The project aims to increase coolant outlet temperatures while maintaining reliable component cooling, creating better conditions for efficient waste-heat recovery.

      Higher usable heat levels can support integration into district heating, building heating and industrial applications while reducing the energy required for conventional cooling infrastructure.

       

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      SEVEFORM Feasibility study

      Title

      Development and initial validation of a passive, self-regulating flow control system for server liquid cooling (SEVEFORM) 
      Topic Passive flow control for liquid-cooled servers, shape-memory alloys, self-regulating valves and high-temperature cooling  
      Funding program ZIM – Feasibility Study (Programme of the German Federal Government BMWE)corecooling-logo-bmwe-zim
      Project duration  01/01/2025 – 08/31/2025 
      Partner XCCES GmbH 

       

       

      FROM CONCEPT TO SELF-REGULATING COOLING

      The SEVEFORM feasibility study investigated the technical potential of passive, temperature-dependent flow regulation for liquid-cooled server systems. The work provided the foundation for the development of self-regulating cooling concepts using thermally activated flow-control elements.

      The results formed the basis for the subsequent development of the SEVEFORM technology.

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       Green ICT / COCO

      Title

      Hot-water cooling of IT components for waste heat utilization in data centers (COCO – CoreCooling) 
      Topic Solder-based high-temperature liquid cooling for servers, energy-efficient data centers and waste heat utilization 
      Funding program

       Green ICT Space – Green ICT @ FMD 

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      Project duration  01/02/2024 – 01/02/2025 
      Partner  Fraunhofer IZM, XCCES GmbH 

       

       

      HOT-WATER COOLING FOR ENERGY-EFFICIENT IT

      The GREEN ICT / COCO project investigated high-temperature cooling concepts for IT components with a focus on efficient thermal interfaces and reduced thermal resistance. The objective was to transfer component heat into the liquid cooling circuit at the highest practical temperature level.

      This approach improves cooling efficiency and increases the potential for subsequent waste-heat utilization in energy-efficient IT and data center environments.